Wafer Level Optics

Wafer Level Camera

  • Consulting
  • Master Arrays, PDMS Stamps
  • Packaging, Prototyping using the new SUSS MicroTEC MA/BA8 Gen3

Wafer Level Packaging (WLP)

  • Semiconductor manufacturing technologies like resist coating, photolithography, and reactive-ion etching are used for manufacturing of high-quality microlens arrays.
  • With lateral precision in the range of 50 nm, the excellent lens-profile accuracy and array uniformity allow accurate alignment of such microlens arrays to subsequent optics or optoelectronics structures on the full wafer scale.

Image Gallery

  • Lens Master - Imprinted Wafer 8"
  • Double-Sided Imprint

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