Wafer Level Optics
Wafer Level Camera
- Master Arrays, PDMS Stamps
- Packaging, Prototyping using the new SUSS MicroTEC MA/BA8 Gen3
Wafer Level Packaging (WLP)
- Semiconductor manufacturing technologies like resist coating, photolithography, and reactive-ion etching are used for manufacturing of high-quality microlens arrays.
- With lateral precision in the range of 50 nm, the excellent lens-profile accuracy and array uniformity allow accurate alignment of such microlens arrays to subsequent optics or optoelectronics structures on the full wafer scale.
Lens Master - Imprinted Wafer 8"
- Double-Sided Imprint
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